Panel: Beyond the wrapper – what does a resilient AI compute financing model look like?

28 Jan 2027
Leadership Stage
Debt , Datacentre , Cloud

AI compute is giving rise to several distinct credit propositions, from IG-backed/hyperscaler-supported capacity to GPU-linked lending and more speculative corporate exposure. The presence of these backstops and OEM support materially improves financeability, but does not necessarily eliminate contract, technology or residual value risk. The market is now testing which protections support repeatable, infrastructure-style financing and which structures remain the domain of specialist capital. This session will explore:

  • Which components are now indispensable to securing finance? And which weaknesses can be addressed through pricing, leverage or structural protections?
  • Which parts of AI infrastructure can support infrastructure-style debt? And where do technology and private credit risks remain?
  • Regarding hyperscaler credit wraps, how are termination rights, customer concentration and unsupported residual periods being assessed?
  • Who ultimately owns GPU obsolescence risk? And which protections, such as amortisation and step-in rights, are becoming standard?
  • Which US structures can transfer successfully to Europe?